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Jet Process |
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Specialists in Gold Tin Solder and Other Coatings & Other Advanced Thin Films |
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Microelectronics . Semiconductor Packaging . Optoelectronics & Photonics . Solid State Lighting . |
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Company Profile Jet Process Corporation (JPC), founded in 1991, is the sole owner and developer of the Jet Vapor Deposition™ (JVD™) process for thin film gold-tin solders and other thin film coatings. JPC owns over 30 U.S. and foreign patents covering the JVD technology, a breakthrough proprietary thin film coating technique, and our staff of scientists, engineers and support personnel is uniquely experienced in JVD process methods. Jet Process has been supported by venture capital funding and has invested over $20 million in developing JVD's unique capabilities and intellectual property assets. JPC's headquarters located in Wharton Brook Industrial Park, North Haven, CT include lab, production and office facilities, housing both JVD production tools and many configurations of JVD production, prototype and R&D equipment. In-house capabilities also include metrology tools for testing coating characteristics. JPC provides rapid turnaround thin film JVD metallizing and dielectric coating services for AuSn Solders and related materials systems and builds custom R&D coating equipment. Jet Process' corporate goal is to develop JVD as a major thin film coating technology in leading worldwide markets, including those listed below. Our new business model focuses on providing JVD thin film coating services and products for development, prototyping and production, based on JVD's unique, competitive advantages in making high quality thin film metal, dielectric and other coatings for advanced applications and products in:
Jet Vapor Deposition is a truly "disruptive" thin film coating technology, enabling innovative and otherwise unavailable solutions for advanced technology applications. JVD's low temperature (<100°C), low vacuum (1-5 Torr) operating conditions provide high rate deposition, short cycle times, high source material utilization, wide process versatility and safe, clean, environmentally sound and user friendly operation. JVD's process conditions offer many advantages over competing thin film metallizing techniques such as sputtering, evaporation, CVD and plating. These include compatibility with heat sensitive substrates including ceramics, metals, composites, glass, plastic and others. JVD equipment produces high quality thin film coatings at lower capital and operating cost than conventional thin film systems. Purchase of JVD proprietary R&D systems includes a license to use Jet Process patents and proprietary technology. Recently introduced JVD production coating services are being used by leading manufacturers of microelectronics, semiconductor packaging, advanced sensors, solid state lighting, optoelectronics, telecommunications and MEMS components and products for many advanced metallizing requirements. For example, JVD thin film eutectic gold-tin solder layers (1-20 microns) and titanium-platinum-gold or titanium-tungsten bond/barrier layers are replacing solder pastes and preforms in laser and microelectronics packaging applications, meeting wafer lever processing requirements for smaller dimensions, high reliability, longer life, thermal management solutions, simplified assembly, semiconductor process compatibility, higher device yields and cost. JVD low temperature deposition is also used for low temperature lead free solder alloys such as indium-tin and other binary and tertiary compounds. In addition, JVD’s low temperature, low vacuum operating conditions are compatible with virtually all mask or pattern materials, photoresists, etc., including use with materials which outgas. JPC provides contract R & D services for selected new commercial applications in other multi-billion dollar markets enabled by JVD's unique process capabilities, and may be interested in selected joint development programs and licensing opportunities. Jet Process has produced platinum catalyst cluster films for polymer electrolyte membrane fuel cell (PEMFC) components, using 2 novel JVD deposition techniques, both of which can be incorporated in JVD large area reel to reel coating systems. JVD metal cluster deposition has also been demonstrated for microelectronic applications including for high density flip chip solder bumping and via filling. Bumps with feature dimensions as small as 4 X 4 microns with 8 micron pitch have been demonstrated. Other prior JPC collaborative and/or internal development efforts have included JVD thin film coatings for advanced batteries, superconducting and other energy market applications, and for turbine engine, biomedical and solid state imaging components. JPC has worked for and/or received development support from many advanced technology leaders including IBM, Intel, Motorola, Texas Instruments, General Electric, Hewlett-Packard, BAE, Ericsson, Lucent, Raytheon, Agilent, Lockheed Martin, 3M Company, Pratt & Whitney and SEMATECH. |
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Jet Process Corporation |
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