Jet Process
Corporation

Specialists in Gold Tin Solder and Other Coatings & Other Advanced Thin Films

Microelectronics . Semiconductor Packaging . Optoelectronics & Photonics . Solid State Lighting .
Advanced Sensors . Aerospace . Medical . Communications . MEMS

Oxide and Nitride Materials and Compounds
Service Coating and Custom Equipment

Jet Process has a number of processes available for depositing compound materials including oxides and nitrides. We offer custom coating services for customer designed materials systems and can provide JVD R&D systems designed for production of the various compound materials. The JVD™ process deposits a wide range of simple and compound metal oxides and nitrides for use in electronic fabrication (e.g. capacitor dielectrics) and for other applications, such as hard coatings, thermal barrier layers, and component encapsulation.

In contrast to CVD processes, the JVD™ process typically uses elemental sources including a wide range of metals and semiconductors (silicon and germanium). JVD™ oxide and nitride deposition are therefore carbon-free processes. The JVD™ process takes advantage of fast flow source conditions to deposit these materials reactively without deleterious reactions inside the source itself. JVD’s capability for using various materials sources allows easy mixing of multiple metal components, thereby uniquely enabling reproducible combination of complex dielectrics, not achievable by other thin film methods.

Examples of electronic oxides done by the JVD™ process include transparent conducting films such as indium-tin oxide and aluminum-doped zinc oxide. Low resisistivity (2 x 10-4 Ohm-cm) in such films is achieved at substrate temperatures below 200C. Other conducting oxides such as ruthenium oxide (RuOx) and LaCuOx are readily done by the JVD process.

Aluminum oxide is deposited at similarly low temperatures (<150C) with low trap density for capacitor fabrication. Other oxides, particularly those of the Group IV metals, have favorable electronic properties when deposited by the JVD™ process.

JVD™ is particularly well suited to depositing several families of complex oxides such as ferroelectrics, ferrites, and colossal magnetoresistive (CMR) oxides. These oxides have application in integrated MEMS (micro-electro-mechanical systems) and MOEMS (micro-optoelectro-mechanical systems) devices, in microwave technology and advanced IR sensors as well as in high density data storage. JPC has provided ferroelectric films to corporate customers on a toll-coating basis.

Other applications of JVD™ oxide processes include the deposition of yttria-stabilized zirconia (YSZ) as a thermal barrier coating and silicon dioxide and aluminum oxide for device encapsulation.

Coating services are available to include high rate hard coatings of chromium nitride-(CrN) and hard and bright coatings of titanium and other nitrides.

Custom dielectric deposition systems incorporating proprietary JVD thin film coating process and technology are also available. Jet Process has sold custom JVD tools with multi-source compatibility for complex dielectric film deposition at low temperatures.
 

Jet Process Corporation
57B Dodge Avenue, North Haven, CT 06473
Tel: (203) 985-6000 Fax: (203) 985-6007
e-mail:
sales@jetprocess.com