Jet Process
Corporation

Specialists in Gold Tin Solder and Other Coatings & Other Advanced Thin Films

Microelectronics . Semiconductor Packaging . Optoelectronics & Photonics . Solid State Lighting .
Advanced Sensors . Aerospace . Medical . Communications . MEMS

JPC™ Coating Services

JPC offers development, prototype and production coating services using over 20 in-house custom JVD coating systems, which have a wide variety of configurations. We provide innovative, flexible solutions to customers’ applications development or prototyping needs, as well as offering low cost high or low volume production coating services. Charges for these services are generally very favorable versus competitive services using thin film process alternatives such as sputtering or e-beam evaporation. The table below outlines representative current production coating availabilities.

 
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Current Capabilities and Offerings

Metals

Cu, Au, Ag, Sn, In, Al, Cr, Ni, Ti, Ta, & others;  alloys & nano/micro laminates;  transparent conducting films

Solder Layers

Au/Sn alloy - 80/20,  75/25, 73/27,  70/30;  to 10 microns or more
High density solder alloys bumps: Range: 20 µm bumps, 200 µm pitch to 4 µm bumps, 8 µm pitch

Dielectric Materials

SiO2, Si3N4, group IV metal (Ti, Zr, Hf) oxides, Al2O3, SnO2, indium tin oxide, ZnO, LaNi & LaCu oxide, Pb based PLZT ferroelectric films (Pb-La-Zr-Ti oxide). Typical thicknesses 0.01 to 2 µm

Special Nitride
Materials

Al, Ti & Cr nitride

Substrate
Materials

Ceramics, Metals, Glass, Many Plastics and Composites
e.g.: Si, GaAs, Al2O3, AlN

Substrate Sizes

2" to 12" round, square, & other shapes;  fibers & small pieces

Bond / Barrier

Ti, Cr & Ti/Pt/Au, TiW, Ta

Rates / Thickness

As high as microns / minute on 4" wafer for selected metals
Angstroms to 10s of microns
 Contact us to discuss other metals, substrate sizes and geometries!

Custom Metallizing Equipment

Jet Process has recently introduced its proprietary R&D metallizing tools for new product development to the microelectronics, packaging, optoelectronics, telecommunications and MEMS markets. JVD tools provide solutions to a range of thin film coating needs, enabling the development of novel advanced technologies and devices in these markets.

JVD custom R&D coating systems are configured to meet varied customer applications needs including short runs, prototyping or low volumes. Required tool functions, capacities and performance variables are built into custom designed systems. JVD’s batch metallizing systems are built with rugged components to accommodate varied parts sizes, shapes and quantities, including 2" to 12" wafers, squares and other shapes. JVD deposition chambers can accommodate multiple modular vapor sources, providing unique system versatility. Scanning systems are selected to fit part size and per run production needs. Jet Process provides proprietary, interchangeable, modular metal deposition sources also customized to meet performance needs. JVD sources are small, typically 3"-4" in diameter, and are readily mounted and dismounted on standard flanges on our system chambers. JVD metallizing systems are mounted on rollers for easy portability; system stands, including chambers, motors, motion systems, computer controls, etc. have a typical footprint of 36" x 48". Computer controls and system operation are provided with proprietary custom software. Operator training, system manuals, etc. are included with the tool purchase. JVD system power, gas supply and other facilities requirements are straightforward and standard. JVD tools are compatible with normal microelectronics fabrication facilities, and provide very low operating costs including minimal M&R costs.

JVD R&D systems require no high vacuum components. Low vacuum (1-5 Torr) operating conditions provide very rapid batch process cycle times (typical pumpdown and/or warmup times are 5-20 minutes).

JVD™ Equipment Features and Unique Competitive Advantages

  • Patented technology; proprietary tools; easily upgraded or modified
  • Low temperature process (<100°C), low vacuum process (1-5 Torr)
  • High rate deposition: e.g., one micron AuSn in about 3 minutes on a 4" wafer
  • High quality, high purity, uniform, dense, adherent coatings
  • Rugged, reliable tools and components; modular, interchangeable sources
  • Fast run and cycle times, minimal pumpdown (1-5 Torr); small footprint: 3' x 4'
  • High material utilization cost saving: e.g., Au, Pt and AuSn >90%
  • Low operating costs, low electric and gas consumption
  • Low cost of ownership, minimal maintenance and repair costs
  • Multi-component, multi-layer films, multiple sources, in-situ sequential or co-deposition
  • Ion bombardment at low energy and high current for film densification, stress relief
  • No clean room requirement, no high vacuum equipment
  • Safe, user friendly operation; no special training required
  • Environmentally sound; no toxic precursors or effluents
  • Compatible with standard microelectronic fabrication
     

Jet Process Corporation
57B Dodge Avenue, North Haven, CT 06473
Tel: (203) 985-6000 Fax: (203) 985-6007
e-mail: sales@jetprocess.com