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Jet Process |
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Specialists in Gold Tin Solder and Other Coatings & Other Advanced Thin Films |
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Microelectronics . Semiconductor Packaging . Optoelectronics & Photonics . Solid State Lighting . |
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JVD™ Bond-Barrier Layer / Inert Electrode The stacked combination of gold on platinum on titanium with metal layers typically several hundred to several thousand angstroms in thickness has a range of applications including that of base metallization for solder alloys and as a chemically inert, thermally stable electrode for specialized devices found in MEMS systems. While this metallization scheme has many desirable properties, its major drawback has been the high cost of the precious metals involved. The very high material conversion efficiencies (>90% with Au, Pt or Au/Sn) achieved by JVD thin film metallization now offers major savings for many microelectronic and MEMS applications. Ti/Pt/Au layers deposited by the JVD process have excellent adhesion to a wide range of semiconductor, insulator (particularly ceramic), and metal surfaces. When necessary, adhesion can be enhanced by in-situ plasma pre-clean using JPC’s proprietary e-jet. JVD layers are very dense and highly conductive for a range of thicknesses exceeding one micron, and display a mirror quality top surface. Jet Process offers batch Ti/Pt/Au coating of a range of different part shapes, sizes and substrate materials. The cost of these coatings is lower than those of standard evaporation or sputtering processes because of JVD’s very efficient use of precious metal source material and the ability to limit deposition overspray. Jobs involving high volume coating can be expected to realize the greatest cost savings. Jet Process provides custom JVD metallizing services for these and many other coatings for R&D, prototype and volume applications. Other materials such as chromium, germanium, nickel, titanium-tungsten can also be done as part of a metallization stack without breaking vacuum. For information on availabilities and pricing, please contact us. |
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Jet Process Corporation |
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