Our Specialties

    

LEAD FREE SOLDERS        

Gold-Tin Alloys:    80/20,   78/22,  75/25,  73/27   

Indium & and Indium Alloys:    In,  InSn,  InSnAg,  etc. 

Most Solders Commonly Used in Microelectronics:    Sn,  SnAg,  SnCu,  SnAgCu (SAC),  SnInAg,  SnAgSb,  etc.

 

    ADHESION/BARRIER LAYERS   

    Ti Pt Au,  Ti Ni Au  and others

    RELATED MATERIALS

    Au,  Cu,  Ag,  Sn,  Ni,  Cr,  Ti,  Ta  and others

    BENEFITS
  • Low temperature deposition on photoresist masks
  • Alloy deposition in atomic or nanocluster form;  platinum cluster films       
  • Solder bumps as small as 4 microns diameter
  • A high rate, economical, environmentally clean process
  • Fast turnaround times